Safran Colibrys - World-leading supplier of standard and semi-custom MEMS

Safran Colibrys is a world-leading supplier of standard and semi-custom MEMS based motion sensors to the harsh-environments (Military, Aerospace and Energy) and safety critical (Industrial and Instrumentation) applications. Safran Colibrys family of motion sensors include extremely low noise, shock resistant seismic sensors, high stability shock tolerant inertial and shock accelerometers tilt sensors as well as DC coupled capacitive vibration sensors. The company is active for some 30 years in the development and manufacture of MEMS technologies. Safran Colibrys is based in Yverdon-les-Bains Switzerland and is a new company of Safran Electronics & Defense since 1st January 2013.

Products and services

Inertial sensors: The long term stability, low vibration rectification error and reliability of our standard MEMS capacitive accelerometers consistently meet the continually increasing needs of Inertial Measurement Unit (IMU) and Attitude-Heading and Reference System (AHRS) products for civilian and military applications.

Tilt and vibration sensors: These variable capacitance sensors, because of their inherent high resolution, their high temperature stability and low energy consumption, efficiently meet requirements for shock, vibration or angle measurements in different applications like automotive and railway monitoring and testing, and wind turbines to name a few.

Seismic sensors: These sensors are very resistant to very low noise dedicated to applications such as in oil exploration in the health monitoring of buildings (Structural Health Monitoring) or in stabilizing platforms. This advanced technique easily replaces a traditional geophone or seismometer for different types of seismic measurements.

Contract manufacturing: Colibrys offers contract manufacturing services to both fabless market leaders and companies in strong growth phase (especially in the industrial, telecommunications, and harsh environment markets) who demand specific technical expertise in areas of:

  • Bulk micromachining
  • Wafer assembly, Silicon Fusion Bonding
  • Surface on Insulator (SOI) micromachining
  • Etching, Wet (KOH, HF), Dry (DRIE)
  • Photolithography
  • Diffusion (Oxide, Nitride)
  • Multi stack wafer processing
  • Precision assembly
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